三國: 姑姑&AWS ASICs for AI (TPU)對GPU

本帖於 2025-12-14 10:02:30 時間, 由普通用戶 胡雪鹽8 編輯

https://www.cnbc.com/2025/11/21/nvidia-gpus-google-tpus-aws-trainium-comparing-the-top-ai-chips.html

Custom ASICs, or application-specific integrated circuits, are now being designed by all the major hyperscalers, from Google's TPU to Amazon's Trainium and OpenAI's plans with Broadcom. These chips are smaller, cheaper, accessible and could reduce these companies' reliance on Nvidia GPUs. Daniel Newman of the Futurum Group told CNBC that he sees custom ASICs "growing even faster than the GPU market over the next few years."

 

Besides GPUs and ASICs, there are also field-programmable gate arrays, which can be reconfigured with software after they're made for use in all sorts of applications, like signal processing, networking and AI. There's also an entire group of AI chips that power AI on devices rather than in the cloud. QualcommApple and others have championed those on-device AI chips.

 

 

Google TPUs (Tensor Processing Units)
  • Strengths: Extremely efficient for large-scale training & inference of models like Gemini, using systolic arrays for massive matrix multiplication. Excellent cost-performance (e.g., 4x better for inference). Tightly integrated with Google's network for massive scaling.
  • Weaknesses: Less flexible; designed for specific AI workloads, not general-purpose computing or HPC.
  • Best For: Google's internal services (Search, YouTube), large model training, inference at massive scale. 
 
AWS (Trainium & Inferentia)
  • Strengths: Custom silicon (Trainium for training, Inferentia for inference) designed for performance/cost optimization in AWS, offering better efficiency than GPUs for many cloud workloads.
  • Weaknesses: Like TPUs, less flexible than GPUs for novel research.
  • Best For: AWS customers needing cost-effective, scalable AI compute within the AWS ecosystem. 
 
NVIDIA GPUs (e.g., H100)
  • Strengths: Unmatched flexibility, broad software support (CUDA), runs on-prem/cloud/edge, ideal for R&D, diverse models, and staying at the research frontier. The standard for most AI breakthroughs.
  • Weaknesses: Higher power consumption and cost for highly specific, large-scale tasks where ASICs excel.
  • Best For: General AI development, novel model architectures, hybrid cloud/on-prem deployments, research. 

所有跟帖: 

說結果吧,真看不懂 -通州河- 給 通州河 發送悄悄話 通州河 的博客首頁 (0 bytes) () 12/14/2025 postreply 09:53:12

軍閥混戰;長遠架構 -胡雪鹽8- 給 胡雪鹽8 發送悄悄話 胡雪鹽8 的博客首頁 (177 bytes) () 12/14/2025 postreply 09:54:39

競爭非常激烈, AI精英都是9位數的搶了: ))) -黃局長- 給 黃局長 發送悄悄話 黃局長 的博客首頁 (0 bytes) () 12/14/2025 postreply 09:54:55

金鷹? 片子? -胡雪鹽8- 給 胡雪鹽8 發送悄悄話 胡雪鹽8 的博客首頁 (0 bytes) () 12/14/2025 postreply 09:57:34

多用途芯片和專用芯片的打架,最終會遭到一個中間平衡點。沒啥新鮮的。 -三花錦鯉- 給 三花錦鯉 發送悄悄話 (0 bytes) () 12/14/2025 postreply 09:57:20

穀歌TPU VS 女大 GPU 如同 蘋果Mac VS 微軟視窗 [我愛我家] - 未完的歌 -未完的歌- 給 未完的歌 發送悄悄話 未完的歌 的博客首頁 (193 bytes) () 12/14/2025 postreply 09:58:43

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